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    • 专利摘要:
    1G 16 ABSTRACT The present invention reiates to a buiiding component having a towthermai conductivity vaiue comprising wood materia! having a äüm peroentiiedensity of between 306 and 469 kg/ms, Le. a low density wood materiai. Thepresent invention aiso reiates to building components such as windowcomponents, ie. sashes and frames and door components such as doorframes, and window insuiation materiais oomprising the iow density woodmateriai. The present invention further reiates to a method for sorting out wood materia! having a iow density. Eieoted for puoiioation: Fig. 4
    公开号:SE1150949A1
    申请号:SE1150949
    申请日:2011-10-13
    公开日:2013-04-14
    发明作者:Mattias Braennstroem；Bjoern Kaellander；Joergen Tigerstrand；Matti Myyrylaeinen；Jouko Silen
    申请人:Stora Enso Oyj；
    IPC主号:
    专利说明:

    2G3GBUELDENG CGMPONENTTechnicai fieidThe present invention reiates to a building component comprising awood materia! having a 90th peroentiie density of between 300 and 460 kg/ms,i.e. a iow density wood materiai.
    More particuiariy, the present invention reiates to buiiding componentssuch as window components, i.e. sashes and frames and door componentssuch as door frames, and window insuiation materiais comprising the iowdensity wood materiai.
    The present invention aiso reiates to a method for sorting out woodmateriai having a iow density.:ëasaatst-.iadToday demands on heat insuiation of buiiding components arecontinuaiiy increasing. For a window the increasing demands means thattraditionai constructions can no ionger be instaiied in newiy buiit houses after2015. New constructions and materiais must be used. Houses, commoniyknown as "passiva houses", are more and more vievved as the comingstandard manner when buiiding new houses. By passiva house is meant abuiiding having rninimai heat iosses, which means that there is no need foradditionai heating except for short periods.
    Since additionai heating not is used, the interior comfort requires thatthere are no downdraughts at windows or coid outer waiis. A passiva houseshouid aiso be wind-proof such that draughts dont occur, and there are thusincreasing demands aiso for eg. oioser fits of the sash and frame of windows.
    The U-vaiue of a window is mainiy governed by the giass package, theconstruction of the sash and frame, and the fixation into the wait. Exampies ofinfiuencing factors are the gas and the spacers between the giass panes,seais between sash and frame, and the position and tightness of the framefixation into the wait. The insuiation properties of giass and spacers are todayciose to what is technicaiiy and economicaiiy feasibie, and there are no ionger'EG2G3Gany major improvements expected to be made. Todays deveiopment of thewindow as buiiding component is foremost of the frame and sash.
    During recent years a great number of new sash and frameconstructions have been iaunched to improve the heat insuiation. Layers ofinsuiation materiais that are being giued inte the sash and frame, orcompiicated hoiiow structures are being used to reduce the heat transferthrough the window construction.
    These types ot constructions are far more compiex than traditionaiwooden, aluminium, or PVC based windows which increases the costs. At thesame time the mixture of different types of rnateriais makes recyciing anddestruction more difficult.it is an object of the present disciosure, to provide an improved oraiternative buiiding component, which eiiminates or aiieviates at ieast some ofthe disadvantages ot the prior art buiiding materials.
    A specific object of the present disciosure is to provide an improved oraiternative window component.
    The invention is defined by the appended independent ciaims.Embodiments are set forth in the appended dependent ciaims and in thetoiiowing description and drawings.
    According to a first aspect, there is provided a buiiding componenthaving a iow thermai conductivity vaiue comprising wood materiai having adensity distribution showing a 90th percentiie between 300 and 456 kg/rns.
    By the 90th percentiie is meant the vaiue (or score) beiow which 9Gpercent of the Wood materiai may be found. By “wood density” is meant thetotai weight per unit voiume of wood inciuding moisture.it is the surprising effect that wood materia! with a density between390 and 460 kglms, which is generaiiy considered to be a very iow densitywood materia! that traditionaiiy has not been considered to be suitabiemateriai for buiiding components due to shape stabiiity requirements, canactuaiiy not oniy function as a stabie and durabie materia! for a buiidingcomponent but aiso provide a component that gives a iow tJ-vaiue These”iQ3Gbuilding components may thus have improved heat insuiating propertiesthrough the wood materia! having an extra iow density of soiid substances.
    The estabiished methods to design and produce wooden windows areto a iarge extent based on traditions and utiiize quaiity controi systems partiybased on secondary parameters. Such secondary parameters are densityand gronrth ring width, where wood with high density and narrow growth ringsis seiected in order to provide a window with good durabiiity, dirnensionaistability, and appeaiing surface properties. One example of such secondaryrequirements is the Üanish requirement stating that the ZÛ-percentiie of thewood density must not be beiow 480 kgim3. High wood density is by traditionconsidered a pre requisite in order to produce a good window. i-iowever, withmodern sorting and scanning technique it is possibie to seiect the rawmateria! directiy towards the primary parameters iiite duraioiiity or dimensionaistabiiity. The secondary parameters are no ionger needed.
    By “iow thermai conductivity vaiue" is meant a window componentproviding a iow Li-vaiue. The U-vaiue is standardized vaiue as a measure ofthe heat transmission through a buiiding part as a waii or a window or a giventhiokness of a materiai where iower numbers indicate better insuiationproperties. The U-vaiue of the component shouid not be mixed up with theiambda vaiue of the materiai, which is not depending on the thickness or sizeof the materiai.
    This iow density wood materia! may further come from wood materiai ,such as togs, sorted out from a usuai production, thus rendering the louiidingcomponent production very cost efficient and environrnentaiiy friendiy. Byusuai production is meant that this wood material may be sorted out anddivided from the materia! which is normaiiy used for producing e.g. windowcomponents.
    The surprising resuits indicate that buiiding components made from iovvdensity wood can be used as an economic and staioie aiternative to morecompiex composite designs where wood and insuiation materiais arecombined, or as a means to further improve the properties of such compositedesigns.
    The component may be made from solid wood rnateriai.fi)2GThe wood materia! may thus be from eg. a pine or spruce source.Thus it is aiso the iightest togs of these types of timber that are seiected toform the buiiding component. This is from a traditionai point of view against a!!known ruies for seiecting wood materia! for buiiding components as it is we!!known that wood materia! having a high density, i.e. a heavy materia!provides a better buiiding component.
    According to one embodiment the iambda vaiue of the wood materia!may be in the range of GE and 0.11 W/mK.
    According to one embodiment of the first aspect the buiidingcomponent is a window component.
    This thus means that the wood materia! having a iow density may besorted out from wood materia! aiready being intended for use as windowcomponents and thus means that a higher percentage of the totai woodmateria! may now be used for that purpose. This is thus different from usingwood materiai having an inherentiy iow density such as baisa wood, or usingiameiia of iow density wood materiais such as baisa wood, which is aisogeneraiiy recognised as nor being abie to take heavy ioads if the materia! istoo Eight, i.e. has a too iow density. Typicaiiy a iow lambda vaiue for woodused for a window component is around QGQ -- Qi VV/miá.
    According to this embodirnent, at ieast one of the sash or frame of saidwindow component may comprise a wood iameiia made from said woodmateria! having a 90th percentiie density of between 369 and 460 kgimf”.
    According to an aiternative embodiment the component may be a doorcomponent. The door component may thus be a door frame.
    According to yet an aiternative embodiment of the first aspect thecomponent may be an insuiation materia! made from said wood materia!having a 90th percentiie density of between 300 and 459 kg/m3This insuiation materia! may be used together with other conventiona!types of window components such as normai density spruce or pine, or evenin composite windows. The insuiation materia! may further be used togetherwith other window components having a iow density. The insuiation materia!may thus be arranged as an insuiatioh iayer in eg. a window component.
    The buiiding component may be thermaiiy modified.3GThe therma! modification or the “heat treatment” of the component alsoprovides for an even better shape and form stabiiity, since heat treated Woodsare iess prone to absorbing moisture, i.e. absorbs iess rnoisture than non-heat treated wood. This means that it sweiis and shrinks to a iesser extentthan reguiar, non-heat treated wood.
    For a window or window component this means that the crevice or gapbetween the sash and the frame may be made smaiier without the risk of thewindow sweiiing so much that it can't be opened at times. Smaiier crevioesprovides for a iesser heat transmission and thus a better insulation.
    The heat treatment aiso provides for a way to even further reduce thedensity of the component as wei! as it provides for a protection against decayof the materia! By using the shape stabiiity for a window construction aiiowingiess piay between the sash and frame even further advantages is to begained.
    The heat treatment process may be performed using conventiona!methods, by treating the wood at a high temperature with steam such by themethod disciosed in EPOö95-4Û8.
    Wood materia! that may be treated by this method inciudes pine,spruoe, biroh, aspen and aider.
    The therma! modification or heat treatment provides for a windowcomponent having an even tower density than the unmodified component.The heat treatment further provides for an even better shape and formstabiiity, since heat treated Woods are iess prone to absorbing moisture, i.e.absorbs iess moisture than non-heat treated wood. This means that it svveiisand shrinks to a iesser extent than reguiar, non~heat treated wood.
    The wood materia! may further oomprise heartwood of pine havingpinosyivine contents of more than 5 mg/g.
    The pinosyivine acts as a naturai wood preservative and renders thepine wood more resistant to deoay and rotting. Heartwood from Swedish pineis usuaiiy considered to be very rot-resistant when used above ground and isthus considered to be a good materia! for use in eg. windows. Thecombination of a wood materia! having a iow density with a high pinosyivinecontents may thus provide for a window component having a iow tJ-vaiue, yet2636being wei! suited for use as a component which must withstand the wear ofthe surroundings and decay.
    According to a second aspect there is provided a window framecomprising at ieast one wood iemeiia made from e wood materia! having a96"” percentiie density of between 366 and 466 kgims”.
    According to a third aspect there is provided a wood iameiia which hasbeen made form a wood materia! having a 66th percentiie density of betweensso and 440 :rg/mfThis materia! may be pine or heat treated or thermaiiy modified sprucehaving a iow density. The iambda vaiue for this wood materia! may further bein the range of 6685-61 WifmK.
    According to e fourth aspect there is provided a wood iameiia which ismade from a wood materia! having a 66th percentiie density of between 356and 400 kg/mf.
    This type of materia! may be a thermaiiy modified or heat treated pinehaving a iow density. The iambda vaiue for this wood materia! may further bein the range of 6685-6693 WlmK.
    According to a fiftn aspect there is provided a wood iarneiiacharacterized in that it is made from a thermaiiy treated wood materia! andhaving a sweiiing and shrinking over the width of materia! which is iess than “i% in the range of a reietive humidity (RH) of 35% -- 95 %.
    By sweiiing and shrinking is meant the reiative dimensiona! change asmeasured according to European standard EN 1616 "Wood and parquetfiooring and wood paneiiing and ciadding -- determination of dimensionaistabiiity".
    According to e sixth aspect there is provided a method for sorting outwood materia! having e 66th percentite density of 366-466 kg/m3 cornprisingthe steps of, seiection of suitabie ciasses of iogs, anaiyzing the seiected iogswith an X-ray apparatus for a density measurement of the iogs, and outtingthe togs into boards.
    The method according to the sixth aspect may further cornprise thestep of performing a density measurement of the boards by using a densitymêašüfêmêflt fiêvifiïê.2GBy suitabie ciasses is meant togs suitabie for the production of windowcomponents, such as togs having a reiativeiy iow portion of knots.
    The density measurement device may be a gamma radiation device ora microwave operated device.
    According to one alternative method, a window component made froma wood materia! having a iow density, i.e. a density in the range of ßÛÜ-dådkglms, may be produced according to the foiiowing steps. Timber or togshaving How density may be sorted out from the timber normaiiy used forproducing window components and cut into pianks or boards. Through asecond density measurement these pianks or boards may then be furthersorted based on their density. Optionaiiy the pianks or boards may be spiitand any knots and other impurities may be cut out from the piank or board.The plank or board pieces thus obtained may then be end jointed together toform a singie iarneiia of the same board or piank, but without the impurities.Two or more iameiiae may then be attached to each other, e.g. by giuing theiameiiae, to form for instance wider or L-shaped bianks.
    Brief Description of the DrawindsEmbodiments of the present soiution wiii now be described, by way ofexampie, with reference to the accompanying schematic drawings.
    Fig. 'i is a schematio side view of a window system having a woodframe provided with an insuiation iayer in sash and frame.
    Fig. 2 is a schematic side view of a window system having a soiidwood sash and frame.
    Fig. 3 is a schematic side view of the caicuiated temperaturedistribution in a window system having a wood sash and frame with norrnaidensity pinewood.
    Fig. 4 is a schematic side view of the caicuiated temperaturedistribution in a window system having a wood sash and frame provided withan insuiation iayer.
    Fig. 5 is a schematic side view of the caicuiated temperaturedistribution in a window system having a How density wood sash and frame.2G3GFigi 6 is a diagram showing the iinear correiation between density andDectared lambda vaiue of Stora Enso pinewood products.
    Description of EmbodimentsThe materiai for the window component may be sorted from the woodthat is normaiiy used for windows. The materiai may be sorted out by thefoiiowing method, which shouid not be construed as the oniy manner in whichthe wood materia! may be seiected but as an exampte.in a first step suitabie ciasses of togs are selected where the proportionof heartwood is sufficiently high and the knot structure is suitabie. it isdesirabie to have fewer big knots than many smaiier knots which are spreadthroughout the materia! in order to be abie to cut them out and provide for anentireiy knot free rnateriai.in a second step the togs are being sent through an X~ray scanner atthe sorting at the saw miii. Through X-ray measurements the density of thewood materia! may be determined and the togs with tower density are thenbeing setected. The wood materia! having iow density and the wood materia!having high density may then be cut into smaiier pieoes or boards in separatebatches.
    The precision of the X-ray measurement may be infiuenced by thewater present in the timber, but it is stiti sufficient to be abie to seiect the togshaving high and iow density respectiveiy.in a third step, at the component Eine and the cutting of the boards tobianks, a density measurement device is used to check the density of theboards.
    Since the wood materia! in the component iine is dried, the moisturevariation in the material is greatiy reduced. The reduced moisture variationimproves the acouracy of density measurement and hence aiiows for areduction of the “upper taii” of the density distribution of the materia! Thedensity measurement device may be based on for instance gamma radiationor micro waves.,The raw material, ie. the input timber may thus be conventionai pine orspruce timber.fi)2GA benefit from the sorting procedure is that it is mainiy the upper end ofthe density distribution is affected. The tower end ef the density distribution isnot affected, which has the positive effect that the characteristic strengthproperties of the rnateriai as defined by the šth percentiie of each parameterare infiuenced eniy to a miner degree.
    For the production of window components the bianks are being cut teexcise knets and other defects and then end jeinted to desired iengths.Lameiiae and bianks may then be put together te form iow thermaiconductivity buiiding or window components at a fundamentaiiy tower costand with reduced envirenrnentai impact.
    The insuiatien properties of a buiiding component may be even furtherimproved by treatment at an eievated temperature te provide for a thermaimodification, by cenventionai methods as those disciesed in EPO695408.
    By iow thermal cenductivity is in this regard a building componentmade from a weed materia! having a iambda vaiue beiew 0,1 WlmK, as weiias window frame and sash having a combined U-vaiue beiow 1,2 WImZK.in the foiiewing the infiuence of materia! seiection en heat eonductivityof window sashes and frames has been determined and the resuits ef theseexperirnents are shown beiow, for different window designs. The U-vaiues ofdifferent prefiies have been caicuiated, and the impact of variouscornbinations of materiais has been compared.
    Fig t iiiustrates a window system t which has been used for themeasurements and simuiatiens of the thermai cenductivity of the windowcomponent and profiie. The window system in Fig 'i is provided with a woodsash 2, a wood frame 8, and an insuiation iayer 3 arranged in both the sash 2and frame 8. The window system 1 further oomprises a giass package 4,which in the simuiations is represented by an insuiation iayer cerrespondingto the thickness of a giass package with tripie 4 mrn giass and 18 mmspacers.
    Fig 2 iiiustrates a window system t having a seiid wood sash 7 andframe 9. The window package 4 may aiso in this embedirnent be a tripie-giazed window.'iQ1Gln both Figs t and 2, the window system faces an exterior, i.e. anoutside 6 and an interior, i.e. an inside 5.
    The results show that windows made from low density wood can beused as an economic alternative to more complex composite designs wherewood and insulation materials are combined, or as a means to furtherimprove the properties of such composite designs.
    Additional improvement can be reached by utillzing the dimensionalstability of the thermal modification or heat treatment to minimize gapsbetween sash and frame, reducing convective heat transfer from airmovement.
    The results clearly points out the importance of adopting the design tothe used materials. An efficient use of low density wood material, low densitywood material which has been heat treated, or combinations with insulationmaterial will all benefit from specific designs.
    The calculation is made according to European standard EN lSO10677-2. The caloulations have been made with the software "Bisco" fromPhysibel, modelling steady state heat transfer in ttfvo dimensions.
    Calculations have been made on four different variables:l. Solid pine wood having a normal density and a lambda value of 6.13Wlmlá.2. Solid pine wood having a normal density further comprising a 19 mminsulation layer of lambda value of u.04 VVImK, representing for instanoePUR.3. Low density wood material, pine, having a lambda value of 6.095W/rnlá.4. Low density wood material, pine, further comprising a 19 mminsulation layer of lambda value of 0.Û4 WImK.
    Table l shows that the use of low density pine, either as solid woodframe or as a frame comprising an insulation layer clearly improves the il-11vaiue, ie. the thermai conductivity of the window component or frame ascompared to a norrnai window component comprising pine wood having adensity which is conventionaiiy used for forming window components.
    Tabie 1 further shows that by using oniy iow density pine woodmateriai a tJ-vaiue compared to that of a normai window frame with aninsuiation iayer may be achieved and that by combining a iow density woodmateriai, such as pine, with an insuiation iayer the U-vaiue may besignificantiy improved.
    These vaiues wouid cieariy fuifii the requirements set for so caiiedpassive houses.
    Table 1. Resuits ofcaicuiation of Li-vaiue of window frameVariant Lambda Lambda Li~vaiue improvement iwood insuiation window frame (%)(W/miá) (WlrnK) (WImZK) _ HSoiid normai 0,13 --- 1,143 i »»Pineinsuiation + 0,13 0,04 0,942 17,6normai oine gLow density 0,095 »- 0,94 17,1pineinsuiation + 0,095 0,04 0,837 20,8_ iow density pineÜesign iambda vaiues tor different buiiding materiais are stated byEuropean standard EN 12524. For softwoods iike pine, spruce, or iarch thedesign vaiue is 0.13 W/mK, and for hardwoods iike oak and ash the designvaiue is 0.18 W/mK. if measurements on the specific rnateriai have beendone, a deciared iambda vaiue can be stated which can reduce the vaiue.
    For wood materiais there is a iinear correiation between the densityand the thermai conductivity. The correiations are in principai simiiar for aiiwood materiais as for aii heat treated, i.e. thermaiiy modified wood materiais.Measurements made by SP Technicai Research institute of Sweden havedetermined the iinear correiation between density and iarnbda vaiue for StoraEnso Wood based products, as shown in Figure 6.
    From these caicuiations the 90th percentiie for each desired iarnbdavaiue may be determined This means that a density of 440 kg/mg gives alf)3G12lambda value of GA WrfmK, a density of 386 kglms gives a lambda value of0,09 WImK, and a density of 320 kglms gives a lambda value of G38 W/mK.These values have been theoretically calculated as well as measured andverified by the SP Technical Research lnstitute of Sweden.
    The various build ups of the frames have been testad using differentlambda values to determine the impact on tvi-frame. l-lowever, the U-values ofthe entire windows have not been calculated since this would requireknowledge about fixlngs and hinges which were not known at the time oftesting and simulation.
    The calculatlons of the thermal conductivity of the window systemshave been made in the following seouence:f) Preparatlon of bitmap drawings of each window design with knownmaterials and heat conductivity values inserted, followed by calculation of theU value of the unmodified frame.2) Replacement of materials in the design without altering any cross sections,and calculation of U-values of the new material combination.
    ResultsThe results of the calculation are shown graphically and in figures.Typical graphic results are shown in Figures 3, 4, and 5 where isothermallines are marked. Figure 3 illustrates the temperature and heat flow in awindow frame comprising a solid pine material of normal density having alambda value of S313 W/mK. Figure 4 illustrates as a graphic presentation thetemperature and heat distribution in a normal density pine wood windowframe comprising an insulation layer having a lambda value of 0,64 W/rnK.The positive impact of the insulation is clearly seen as the isothermal lines areclose to each other in the insulation layer, and that the temperature of theinside of the frame is slightly higher.lt is critical that the insulation material form a tight barrier across theheat flow through the frame and sash without gaps. The ihsulation shall be2G13piaced where the temperature gradient is steep, such as in direct contact withthe giass package and seais.
    The insuiation seems to provide a greater improvement of theproperties the more advanced the window design is. Fiaws in the designquickly reduce the positive infiuence of the insuiation. Detaiis iike extra seaisand reduced width ot gaps can have as much infiuence as the insuiationiayer. Aii detaiis need to be correct, in a pooriy designed window, the woodmateriai wiii have a greater impact.
    Figure 5 iiiustrates the temperature and heat fiow in a window framecomprising a soiid iow density pine materia! having a lambda vaiue of QGQSW/mK.
    A comparison between Figs 3, 4, and 5 cieariy show that both thecomposite frame made from insuiation and wood, and the soiid iow densitywood component as shown in Fig 5 provides for a reduction in heat fiow, inthat these window component provides a better insuiation, and iess heatieakage from the inside to the outside. The improved insuiation properties notoniy iead to reduced heat ioss, but aiso iead to a higher surface temperatureon the inside with reduced risk for condensation and mouid growth in coidperiods.in view of the above detaiied description of the present invention, othermodifications and variations wiii become apparent to those skiiied in the art.i-ioweven it shouid be apparent that such other modifications and Variationsrnay be effected without departing from the spirit and soope of the invention.
    权利要求:
    Claims (15)
    [1] 1. A buiiding component having a iow thermai conduotivity vaiuecharacterized in that it comprises wood materiai having a density distributionshowing a 00th percentiie between 300 and 460 kg/mâ.
    [2] 2. The buiiding component having a iow thermai conductivity vaiue asciaimed in ciaim 1, wherein the component is made from soiid wood materiai.
    [3] 3. The buiiding component having a iow thermai conductivity vaiue asciaimed in any one of ciaims 1-2, wherein the iambda vaiue of the woodrnateriai is in the range of 0.0 and 0.11 WImK.
    [4] 4. The buiiding component having a iow thermai conductivity vaiue asciaimed in any one of ciaims 1-3, wherein the buiiding component is a window component.
    [5] 5. The buiiding component having a iow thermai conductivity vaiue asciaimed in ciaim 4, wherein at ieast one the sash or frame of said windowcomponent comprises at ieast one wood iameiia made from said woodmateriai having a 90th percentiie density of between 300 and 460 kglm3.
    [6] 0. The buiiding component having a iow thermai conductivity vaiue as ciaimed in ciaim 1, wherein the component is a door component.
    [7] '. The buiiding component having a iow thermai oonductivity vaiue asciaimed in ciaim 1, wherein the component is an insuiation materiai madefrom said wood materiai having a 90"* percentiie density of between 300 and450 tag/mt.
    [8] 8. The buiiding component having a iow thermai conductivity vaiue asciaimed in any one of the preceding ciairns, wherein the buiiding componentis thermaiiy modified. 29 3G
    [9] 9. The huitding component having a iow therma! oonduotivity vaiue asoiaimed in any one of ctaims ti, wherein the wood materia! further comprises heartwood of pine having a pinosyivine contents of more than 5rngig.
    [10] 10. A window frame oharaoterized in that it comprises at teast onewood tamelta made from a wood materia! having a 90"' peroentiie density ofbetween 300 and 460 kgims.
    [11] 11. A wood tameita oharacterized in that it has been made form a woodmateria! having a 9G” peroentiie density of between 350 and 440 kg/m3.
    [12] 12. A wood tameiia oharaoterized in that is made from a wood materiathaving a so!!! perceniiis density er samsas :iso and aoo itg/mf.
    [13] 13. A wood iameiia oharaoterized in that it is made from a thermattytreated wood rnateriat and having a sweiiing and shrinking over the width ofmateria! which is iess than 1 % in the range of a reiative humidity (RE-t) of 35%~ 95 %.
    [14] 14. A method for sortirrg out wood materia! having a 90th oercentiiedensity of 300-460 kg/ma oomprising the steps of: d) selection of suitahie oiasses of togs, e) anatyzing the seieoted togs with an X-ray apparatus for a densitymeasurement of the togs, and f) cutting the togs into boards.
    [15] 15. The method for sorting out wood materia! having a 90"* percentiiedensity of 300-469 kg/mä as otaimed in otairn 14, further oomorising the stepof: g.) performing a density measurement of the boards hy using a density measurement device.
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    同族专利:
    公开号 | 公开日
    SE537956C2|2015-12-01|
    EP2581539A1|2013-04-17|
    CN103206141A|2013-07-17|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    AU5260090A|1989-03-29|1990-10-22|Visionsmart, Inc.|Real-time lumber grading process and system|
    ES2154676T3|1993-05-12|2001-04-16|Valtion Teknillinen|PROCEDURE FOR INCREASING THE RESISTANCE OF CELLULOSICAL PRODUCTS AGAINST FUNGI AND PUTREFACTION.|
    AU3401099A|1998-04-17|1999-11-08|Cae Electronics Ltd.|Method and apparatus for identification of probable defects in a workpiece|
    FR2922583A1|2007-10-19|2009-04-24|Sarl Portes Ellipse Sarl|DOOR BLOCK COMPRISING FIREFIGHTING MEANS|
    PL386655A1|2008-12-02|2010-06-07|Tomasz Wiktorczyk|Door or window frame sill|
    CN201314179Y|2008-12-11|2009-09-23|陈禄璿|Inner frame of window with heat insulating effect|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    SE1150949A|SE537956C2|2011-10-13|2011-10-13|Building component, window frame and laminate with low density process|SE1150949A| SE537956C2|2011-10-13|2011-10-13|Building component, window frame and laminate with low density process|
    EP12187883.9A| EP2581539A1|2011-10-13|2012-10-10|Building component|
    CN201210599136XA| CN103206141A|2011-10-13|2012-10-15|Building component|
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